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Company which join HKTDC fair exhibitions would enjoy a 50% subsidy
Issued dateˇG24/04/2020
SourceˇGHong Kong
The HKSAR Government has announced the launch of the Convention and Exhibition Industry Subsidy Scheme on 21 February. Any company - local or overseas, large or small - will be subsidised 50% of its participation fee, subject to a cap of HK$10,000 and this will only apply to the fairs organised by the Hong Kong Trade Development Council.
 
The Hong Kong International Printing and Packaging Fair 2020 is covered under this subsidy scheme. The subsidy will be deducted from the participation fee directly. Hong Kong companies which have obtained subsidy from the scheme, if eligible, can still apply for the Dedicated Fund on Branding, Upgrading and Domestic Sales (BUD Fund) or the SME Export Marketing Fund (EMF) for funding on a matching basis of the remaining exhibition-related expenses. With effect from 20 January 2020, the cumulative funding ceiling per SME under EMF has been increased from HK$400,000 to HK$800,000 and companies may apply for initial payment for their planned export promotion activities.
 
For the updated guide to application, please visit https://www.smefund.tid.gov.hk/english/emf/files/EMF_Guide_Eng.pdf.
 
If you have any questions regarding the subsidy or application, please contact :

Ms. Lolita Chan +852 2240 4614/lolita.wy.chan@hktdc.org
Ms. Jess Hui +852 2240 4801/jess.lh.hui@hktdc.org
Mr. Horasis Lung +852) 2240 4613/horasis.sy.lung@hktdc.org

 

 
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